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20
2025-07
Sony has developed a new three-layer stacked CMOS image sensor, promising significant improvements in various performance aspects.
16
2025-07
High-performance face-to-face integrated stacked QLED
Quantum dot light-emitting diodes (QLEDs), through the lamination technology of vertically integrating multiple light-emitting units, can theoretically achieve a linear increase in device brightness and efficiency, bringing revolutionary opportunities to ultra-high-definition displays and solid-state lighting fields.
12
2025-07
Hyperspectral channel density on-chip diffractive speckle spectrometer
Driven by the demand for high-performance miniature spectrometers, research on chip-scale spectrometers is continuously breaking through towards high integration, high resolution, and large bandwidth. This work proposes a silicon-based on-chip spectrometer based on cascaded disordered metasurfaces. Through various on-chip wavefront modulation mechanisms, high-spectral speckle is generated, which expands the number of spectral channels with a compact chip size, thus achieving extremely high on-chip spectral channel density and providing an effective means for achieving high-resolution, large-bandwidth spectral detection.
23
2025-06
Binary optics and metasurface lenses
Bichromatic optics is a subject or an optical technology; the concept of a meta-lens is more inclined to be a device.
23
2025-06
Scattering and diffraction
10
2025-06
Type-II superlattice (T2SL) infrared detectors offer high sensitivity and fast response speeds, making them suitable for long-range imaging and high-speed moving target tracking. Quantum efficiency (QE) is a key indicator of the ability of a photoelectric detector to produce high-quality images, and improving the QE of T2SL infrared detectors is of great significance.
01
2025-06
26
2025-05
Topological defects in topological photonics have been extensively studied because they facilitate the exploration of physical essence and effective control of electromagnetic wave propagation.
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